With a hardness of around 60 Shore 00, the electro casting resins in Wevo’s WEVOSIL 2210x series have a supersoft consistency when cured. The result: excellent damping of stresses such as vibration or shocks. What’s more, thanks to their modern fillers, these three potting compounds also combine all the advantages of thermally conductive silicones, including very good basic adhesion and elongation at break of more than 100 per cent.
THREE TYPES – THREE THERMAL CONDUCTIVITIES
The three WEVOSIL types have different levels of thermal conductivity, meaning users can select the right solution depending on specific customer and component requirements:
- WEVOSIL 22106 FL: Thermal conductivity: 0.5 W/m-K*, density: 1.38 g/cm³ – when heat dissipation is a must but the focus is on low material density as a way to save weight.
- WEVOSIL 22102 FL: Thermal conductivity: 1.0 W/m-K*, density: 1.68 g/cm³ – when good heat dissipation is needed.
- WEVOSIL 22105 FL: Thermal conductivity: 1.5 W/m-K*, density: 2.61 g/cm³ – when the application calls for both high temperature resistance and above-average heat dissipation.
In addition to their heat-dissipating function, all three variants meet the requirements for classic heat-resistant silicones. The long-term temperature resistance is 180 °C to 200 °C, depending on the type – a key criterion for use with thermally demanding electronic components.
FLOWABLE FORMULATION HELPS OPTIMISE PROCESSES
With their high flowability, these silicone potting compounds ensure reliable and efficient potting of electronic components. All WEVOSIL 2210x grades feature a standard viscosity < 5,000 mPa·s, making the materials ideal for precise, bubble-free potting of small cavities or components with complex geometries.
Thanks to their special material properties, the Wevo products are the solution of choice for advanced electrical components requiring high mechanical stability, thermal conductivity and heat resistance. Amongst other things, the potting compounds are driving technological progress in modern circuits, EMI/Pi filters and PFC circuits as well as in ECUs for trains and electric vehicles.
* Note: Thermal diffusivity and conductivity were measured according to DIN EN ISO 22007-2:2015-12 using the hot disc method, which is carried out without pressure – in contrast to the ASTM D5470-12 method. Due to the ultra-soft consistency of the material, significantly higher values could be achieved using the ASTM method; however, these cannot be achieved in the potted state without pressure on the potting compound.
Image source: © WEVO-CHEMIE GmbH
